专利名称：CONDUCTIVE COPPER PASTE发明人：KAZUMASA EGUCHI,FUMIO
NAKATANI,SHINICHI WAKITA,HISATOSHIMURAKAMI,TSUNEHIKO TERADA
申请号：AU7076487申请日：19870330公开号：AU7076487A公开日：19871008
摘要：A conductive copper paste composition adapted to yield a highly conductivefilm receptive to solders without pretreatment is disclosed. This conductive pastecomprises a copper metal powder, a resin component including a thermosetting resin,and an assortment of additives. In use, the paste is applied to an insulation substrate to apredetermined circuit pattern and cured in situ. Soldering can then be performed directlyon the cured circuit. This contributes not only to the conductivity of the circuit butdispenses with the activation treatment and electroless plating or electroplating thathave heretofore been essential prior to soldering. The invention, therefore, results in asubstantial curtailment of production process and a proportional econimic advantage. Inaddition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so onin the manufacture and assembly of electronic components and circuits.
申请人：TATSUTA DENSEN KK
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