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Thermal barrier in building structures

2020-05-29 来源:步旅网
专利内容由知识产权出版社提供

专利名称:Thermal barrier in building structures发明人:Allan Wingfield申请号:US13062589申请日:20090826公开号:US09624663B2公开日:20170418

专利附图:

摘要:A building structure includes a base structure (), a thermal barrier layer () and anexternal layer (). The thermal barrier layer may be a three-dimensional matrix offilaments. The filaments may be irregularly looped and intermingled in a highly porous,three-dimensional structure with a large open space. The filaments form a thermal

barrier by reducing the physical contact between the external layer and the basestructure. The filament material is low in conductivity, so little heat transfer occursbetween the external layer and the filaments.

申请人:Allan Wingfield

地址:Fairview NC US

国籍:US

代理机构:Oliff PLC

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