专利名称:Thermal barrier in building structures发明人:Allan Wingfield申请号:US13062589申请日:20090826公开号:US09624663B2公开日:20170418
专利附图:
摘要:A building structure includes a base structure (), a thermal barrier layer () and anexternal layer (). The thermal barrier layer may be a three-dimensional matrix offilaments. The filaments may be irregularly looped and intermingled in a highly porous,three-dimensional structure with a large open space. The filaments form a thermal
barrier by reducing the physical contact between the external layer and the basestructure. The filament material is low in conductivity, so little heat transfer occursbetween the external layer and the filaments.
申请人:Allan Wingfield
地址:Fairview NC US
国籍:US
代理机构:Oliff PLC
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