Laminate for treatment of a wafer device, temporar

专利名称：Laminate for treatment of a wafer device,

temporary adhesion composition, andtemporary adhesion film

发明人：Yoshitaka Kamochi,Yu Iwai,Mitsuru

Sawano,Ichiro Koyama,Atsushi Nakamura

申请号：US15711226申请日：20170921公开号：US10287458B2公开日：20190514

专利附图：

摘要：A laminate includes, sequentially and adjacent to each other: a first base

material; a temporary adhesion film; and a second base material, in which the tensileelastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K7161:1994 is in a range of 25 to 2000 MPa. A base material is peeled off by fixing any oneof the first base material and the second base material of the laminate at 25° C. andpulling an end portion of the other base material up in a direction perpendicular to thesurface of the other base material from an interface with the temporary adhesion film ata speed of 50 mm/min, and the force applied during the pulling is measured using a forcegauge and the value is 0.33 N/mm or less.

申请人：FUJIFILM Corporation

地址：Tokyo JP

国籍：JP

代理机构：Sughrue Mion, PLLC

更多信息请下载全文后查看