专利名称：Flux for soldering, soldering method, and
printed circuit board
发明人：Kazuki Ikeda,Hisao Irie,Toshinori
Shima,Takaaki Anada,Syunsuke Ishikawa
申请号：US11727014申请日：20070323
公开号：US20070186997A1公开日：20070816
摘要：A flux for soldering used when soldering is performed to a board subjected toelectroless nickel plating, the flux containing resin having film forming ability, activator,and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight ofthe total amount of flux. The use of this flux suppresses diffusion of nickel solder insoldering portions, and prevents concentration of phosphorous, thereby improving thebonding strength of soldering.
申请人：Kazuki Ikeda,Hisao Irie,Toshinori Shima,Takaaki Anada,Syunsuke Ishikawa
地址：Kakogawa-shi JP,Kakogawa-shi JP,Kakogawa-shi JP,Kakogawa-shi JP,Kakogawa-shi JP
国籍：JP,JP,JP,JP,JP
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