专利名称：Mounted semiconductor module with a
mold resin portion
发明人：Dai Yoshii,Masaaki Tanigawa,Kensuke
Takeuchi
申请号：US15541919申请日：20150513公开号：US10217683B2公开日：20190226
专利附图：
摘要：A semiconductor module is provided in which a semiconductor element ismounted and a plurality of outside connecting modules are drawn from a side of a mold
resin portion. To ensure sufficient space for a holding tool used in mounting thesemiconductor module to a device with a simple structure, holding side portions areprovided for at least two opposing corner portions of corner portions between adjacentsides of the mold resin portion.
申请人：Mitsubishi Electric Corporation
地址：Tokyo JP
国籍：JP
代理机构：Sughrue Mion, PLLC
代理人：Richard C. Turner
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