专利名称：Leadframe for semiconductor device发明人：Kazumitsu Seki,Harunobu Sato,Muneaki Kure申请号：US11386920申请日：20060322公开号：US07329944B2公开日：20080212
专利附图：
摘要：A leadframe for a semiconductor device of the present invention is a leadframefor a semiconductor device having a stage section where a semiconductor chip is to bemounted, an inner lead section connected to the stage section, and an outer lead sectionconnected to the inner lead section. The leadframe has (1) a nickel (Ni) layer , (2) a
palladium (Pd) or palladium alloy layer , (3) a tin (Sn) or tin alloy layer or a zinc (Zn) or zincalloy layer , or , and (4) a gold (Au) layer , or , all of which are formed on a base material Bforming the leadframe in sequence from the surface of the leadframe.
申请人：Kazumitsu Seki,Harunobu Sato,Muneaki Kure
地址：Nagano JP,Nagano JP,Nagano JP
国籍：JP,JP,JP
代理机构：Rankin, Hill, Porter & Clark LLP
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