专利名称：Semiconductor chip package device having a
rounded or chamfered metal layer guardring
发明人：Seong Min Lee申请号：US08/840233申请日：19970411公开号：US05811874A公开日：19980922
摘要：A semiconductor chip packaging device includes a lead frame electricallyconnected to the chip and mechanically supporting the chip; a metal layer guard ringformed along at least one peripheral edge of an active surface of the chip; at least oneslit formed at corner parts of the chip; a passivation layer covering the metal layer guardring, the chip and the lead frame; and a package body made of a molding resinencapsulating the passivation layer, the lead frame, the metal layer and the chip; themetal layer guard ring being chamfered or rounded at corner parts of the chip to reduceshear stresses at the corner parts of the chip.
申请人：SAMSUNG ELECTRONICS CO., LTD.
代理机构：Jones & Volentine, LP.
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