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IPC规范

2022-06-29 来源:步旅网
一.設計部份IPC-M-106IPC-2220IPC-2221AIPC-2222 IPC-2223IPC-2224IPC-2225IPC-2226IPC-SM-782AIPC-EM-782IPC-D-859IPC-1902SMC-WP-004IPC-PWB-EVAL-CHIPC/JPCA-2315IPC-2615IPC-A-311IPC-D-279IPC-D-310CIPC-D-322IPC-D-422IPC-PWBADV-SG02IPC-PWB ADV-CD (CD) IPC-PWB-CRT-SG01IPC-PWB-CERTCD1 (CD)IPC-2531IPC-2541IPC-2546IPC-2547 IPC-2571IPC-2576IPC-2578 IPC-2511A IPC-2501 IPC-2511B IPC-2512A IPC-2513AIPC-2514A IPC-2515A IPC-2516AIPC-2517AIPC-2518ATechnology Reference for Design Manual設計技術手冊

Design Standard Series設計標準系列手冊

Generic Standard on Printed Board Design印製板設計通用標準

Sectional Standard on Rigid Organic Printed Boards剛性有機印製板設計分標準

Sectional Design Standard for Flexible Printed Boards撓性印製板設計分標準

Sectional Standard of Design of PWB for PC CardPC卡用印製電路板分設計分標準

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies有機多晶片模塊(MCM-L)及其組裝件設計分標準

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互連(HDI)印製板設計分標準

Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2表面安裝設計及連接盤圖形標準(包括修訂1和2)

Surface Mount Design & Land Pattern Standard Spreadsheet表面安裝設計及連接盤圖形標準

Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多層混合電路設計標準

IPC/IEC Grid Systems for Printed Circuits IPC/IEC印製電路網格體系Design for Success成功的綜合設計分析手冊

Printed Circuit Board Defect Evaluation Chart印製板缺陷評估圖冊

Design Guide for High Density Interconnects & Microvias高密度互連(HDI)和微通孔設計指南

Printed Board Dimensions and Tolerances印製板尺寸和公差

Process Controls for Phototool Generation and Use照相版製作和使用的過程式控制

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies高可靠表面安裝印製板組裝件技術設計導則

Guidelines for Phototool Generation and Measurement Techniques照相版製作指南和測量技術

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用標準在制板尺寸的印製板尺寸選擇指南

Design Guide for Press Fit Rigid Printed Board Back Plane壓配合剛性印製背板設計指南(HARD COPY)

PCB Advanced Designer Certification Study Guide印製電路板高級設計師証書學習指南和多媒體光盤

(HARD COPY)

PCB Designer Certification Study Guide印製電路板設計師証書學習指南和多媒體光盤

Standard Recipe File Format SpecificationSMEMA發布:標準\"菜單\"(過程式控制)檔格式規範注:SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}

Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication電子製造車間現場設備資訊溝通(CAMX)通用要求

Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印製板組裝設備分要求

Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication車間現場電子檢驗及測試設備資訊溝通分要求

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)電子製造供應鏈資訊溝通分要求 產品數據交換

Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – ProductData eXchange

製成態產品-產品數據電子製造供應鏈資訊溝通分要求

Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange

材料單及產品設計構造數據-產品數據交換供應鏈資訊溝通分要求

Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology實施產品製造數據描述及其傳輸方法學的通用要求

Definition for Web-Based Exchange of XML Data XML數據網絡交換定義

Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML SchemaMethodology

實施產品製造數據描述及其網絡傳輸方法學的通用要求

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description實施製造數據描述管理方法的分要求

Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description實施製造數據描述繪制方法的分要求

Sectional Requirements for Implementation of Printed Board Manufacturing Data Description實施印製板製造數據描述的分要求

Sectional Requirements for Implementation of Bare-Board Product Testing Data Description實施裸板成品測試數據描述的分要求

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description實施已組裝板製造數據描述的分要求

Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description實施組裝件在線測試數據描述的分要求

Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description實施零部件製造數據描述的分要求

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