专利名称:Sputtering device发明人:Nobuyuki Takahashi申请号:US11125157申请日:20050510
公开号:US20050252767A1公开日:20051117
专利附图:
摘要:The object of the invention is to provide a sputtering device which can designuniformity of film thickness distribution by corresponding to ablation change of a targetand can gain a stable film quality by uniformity of film growth components. Accordingly, asputtering device according to this invention comprises at least: a vacuum container
defining a vacuum space; a substrate holder for holding a substrate in said vacuumcontainer; at least one sputtering cathode device which is provided with a cathode unitlocated at a position facing said substrate held on the substrate holder and arrangedslantly at a specific angle to said substrate, and a means for moving cathode unit inparallel along said substrate; and a target installed on said cathode unit. The pluralsputtering cathode devices can be also arranged at specific intervals in a circumferentialdirection of the substrate holder.
申请人:Nobuyuki Takahashi
地址:Sagamihara JP
国籍:JP
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