专利名称：HIGH SPEED, HIGH DENSITY, LOW POWER
DIE INTERCONNECT SYSTEM
发明人：HOLLIS, Ernest, E.申请号：EP07796788.3申请日：20070711公开号：EP2052410A2公开日：20090429
摘要：A system for interconnecting at least two die each die having a plurality ofconducting layers and dielectric layers disposed upon a substrate which may includeactive and passive elements. In one embodiment there is at least one interconnectcoupling at least one conducting layer on a side of one die to at least one conductinglayer on a side of the other die. Another interconnect embodiment is a slug havingconducting and dielectric layers disposed between two or more die to interconnectbetween the die. Other interconnect techniques include direct coupling such as rod, ball,dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect couplingsuch as inductive coupling, capacitive coupling, and wireless communications. The die mayhave features to facilitate placement of the interconnects such as dogleg cuts, grooves,notches, enlarged contact pads, tapered side edges and stepped vias.
申请人：BAE Systems Information and Electronic Systems Integration Inc.
地址：65 Spit Brook Road Nashua, NH 03060 US
国籍：US
代理机构：BAE SYSTEMS plc Group IP Department
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