专利名称：Cooling assemblies and power electronics
modules having multiple-porosity structures
发明人：Shailesh N. Joshi申请号：US13935686申请日：20130705公开号：US09257365B2公开日：20160209
专利附图：
摘要：Cooling assemblies and power electronics modules having multiple-levelporosity structures with both a micro- and macro-level porosity are disclosed. In oneembodiment, a cooling assembly includes a jet impingement assembly including a fluid
inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heattransfer substrate having a surface. The heat transfer substrate is spaced apart from thejet plate. A first array of metal fibers is bonded to the surface of the heat transfersubstrate in a first direction, and a second array of metal fibers is bonded to the firstarray of metal fibers in a second direction. Each metal fiber of the first array of metalfibers and the second array of metal fibers includes a plurality of metal particles defininga micro-porosity. The first array of metal fibers and the second array of metal fibersdefine a macro-porosity.
申请人：Toyota Motor Engineering & Manufacturing North America, Inc.
地址：Erlanger KY US
国籍：US
代理机构：Dinsmore & Shohl LLP
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