Bubble memory package with thermal control

专利名称：Bubble memory package with thermal

control

发明人：Wilbur T. Layton申请号：US05/933053申请日：19780811公开号：US04198687A公开日：19800415

摘要：A package of bubble memory components including magnetic bubble memorychips or modules disposed between bias magnets for maintaining and establishingbubbles in said chips, field drive coils for propagating the bubbles established in the chipsand thermal management means for stabilizing and dissipating the heat generated withinthe package including heat conductor means disposed adjacent to the drive coils forconducting heat therefrom and flexible heat conductor means also disposed adjacent thedrive coils and flexed, sometimes folded back, toward other components of the packageto control the heat of these other components thus stabilizing the temperature of thecomponents with respect to the heat generated by the drive coils.

申请人：BURROUGHS CORP

代理人：Joseph R. Dwyer,Kevin R. Peterson

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