SG1626/SG2626/SG3626
DUAL HIGH SPEED DRIVER
DESCRIPTION
The SG1626, 2626, 3626 is a dual inverting monolithic highspeed driver that is pin for pin compatible with the DS0026,TSC426 and ICL7667. This device utilizes high voltage Schottkylogic to convert TTL signals to high speed outputs up to 18V. Thetotem pole outputs have 3A peak current capability, which en-ables them to drive 1000pF loads in typically less than 25ns.These speeds make it ideal for driving power MOSFETs andother large capacitive loads requiring high speed switching.In addition to the standard packages, Silicon General offers the16 pin S.O.I.C. (DW-package) for commercial and industrialapplications, and the Hermetic TO-66 (R-package) for militaryuse. These packages offer improved thermal performance forapplications requiring high frequencies and/or high peak cur-rents.
FEATURES
•Pin for pin compatible with DS0026, TSC426 andICL7667.
•Totem pole outputs with 3.0A peak current capability.•Supply voltage to 22V.
•Rise and fall times less than 25ns.•Propagation delays less than 20ns.
•Inverting high-speed high-voltage Schottky logic.•Efficient operation at high frequency.•Available in:
8 Pin Plastic and Ceramic DIP14 Pin Ceramic DIP16 Pin Plastic S.O.I.C.20 Pin LCCTO-99TO-66
HIGH RELIABILITY FEATURES - SG1626
♦Available to MIL-STD-883♦Radiation data available
♦LMI level\"S\" processing available
EQUIVALENT CIRCUIT SCHEMATIC
VCC
6.5VVREG
2.5K
3K
INV. INPUT
OUTPUT
GND
9/91 Rev 1.1 2/94
Copyright © 1994
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11861 Western Avenue ∞ Garden Grove, CA 92841
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SG1626/SG2626/SG3626
ABSOLUTE MAXIMUM RATINGS (Note 1)Supply Voltage (VCC) ...........................................................22VLogic Input Voltage ...............................................................7VSource/Sink Output Current (Each Output)Continuous ...................................................................±0.5APulse, 500ns ................................................................±3.0AOperating Junction TemperatureHermetic (J, T, Y, R-Packages) ...................................150°CPlastic (M, DW, L-Packages) .......................................150°CStorage Temperature Range ............................-65°C to 150°CLead Temperature (Soldering, 10 Seconds) ...................300°CNote 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into thespecified terminal.THERMAL DATAJ Package:Thermal Resistance-Junction to Case, θJC.................. 30°C/WThermal Resistance-Junction to Ambient, θJA..............80°C/WY Package:Thermal Resistance-Junction to Case, θJC.................. 50°C/WThermal Resistance-Junction to Ambient, θJA............130°C/WM Package:Thermal Resistance-Junction to Case, θJC.................. 60°C/WThermal Resistance-Junction to Ambient, θJA............. 95°C/WDW Package:Thermal Resistance-Junction to Case, θJC.................. 40°C/WThermal Resistance-Junction to Ambient, θJA..............95°C/WT Package:Thermal Resistance-Junction to Case, θJC.................. 25°C/WThermal Resistance-Junction to Ambient, θJA........... 130°C/WR Package:Thermal Resistance-Junction to Case, θJC................. 5.0°C/WThermal Resistance-Junction to Ambient, θJA............. 40°C/WL Package:Thermal Resistance-Junction to Case, θJC.................. 35°C/WThermal Resistance-Junction to Ambient, θJA........... 120°C/WNote A.Junction Temperature Calculation: TJ = TA + (PD x θJA).Note B.The above numbers for θJC are maximums for the limitingthermal resistance of the package in a standard mount-ing configuration. The θJA numbers are meant to beguidelines for the thermal performance of the device/pc-board system. All of the above assume no ambientairflow.RECOMMENDED OPERATING CONDITIONS (Note 2)Supply Voltage (VCC) ..................................4.5V to 20V (Note 3)Frequency Range ...............................................DC to 1.5MHzPeak Pulse Current ............................................................±3ALogic Input Voltage ................................................-0.5 to 5.5VNote 2. Range over which the device is functional.Note 3. AC performance has been optimized for VCC = 8V to 20V.Operating Ambient Temperature Range (TJ)SG1626 .........................................................-55°C to 125°CSG2626 ...........................................................-25°C to 85°CSG3626 ..............................................................0°C to 70°CELECTRICAL CHARACTERISTICS(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55°C ≤ TA ≤ 125°C, SG2626 with -25°C ≤ TA ≤ 85°C, SG3626 with 0°C ≤ TA ≤ 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and casetemperatures equal to the ambient temperature.)ParameterStatic CharacteristicsLogic 1 Input VoltageLogic 0 Input VoltageInput High CurrentInput High CurrentInput Low CurrentInput Clamp VoltageOutput High Voltage (Note 4)Output Low Voltage (Note 4)Supply Current Outputs LowSupply Current Outputs HighNote 4. VCC = 10V to 20V.Test ConditionsSG1626/2626/3626UnitsMin.Typ.Max.2.0VVµAmAmAVVVmAmAVIN = 2.4VVIN = 5.5VVIN = 0VIIN = -10mAIOUT = -200mAIOUT = 200mAVIN = 2.4V (both inputs)VIN = 0V (both inputs)0.75001.0-4-1.5VCC-3187.51.027129/91 Rev 1.1 2/94
Copyright © 1994
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11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
LINFINITY Microelectronics Inc.
元器件交易网www.cecb2b.com
SG1626/SG2626/SG3626
ELECTRICAL CHARACTERISTICS (continued)ParameterDynamic Characteristics (Note 6)Propagation Delay High-Low(TPHL)Propagation Delay Low-High(TPLH)Rise Time (TTLH)Fall Time (TTHL)Supply Current (ICC)(both outputs)Test Conditions (Figure 1)SG1626/2626/3626TA= 25°CTA=-55°C to 125°CSG1626UnitsMin.Typ.Max.Min.Typ.Max.CL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 1000pF (Note 5)CL = 2500pFCL = 2500pF, Freq. = 200KHzDuty Cycle = 50%182525353040204035304040503550305040nsnsnsnsnsnsnsnsmA1725303030Note 5.These parameters, specified at 1000pF, although guaranteed over recommended operating conditions, are not 100% tested in produc-tion.Note 6. VCC = 15V.AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS - FIGURE 1SG1626CHARACTERISTIC CURVESFIGURE 2.TRANSITION TIMES VS. SUPPLY VOLTAGEFIGURE 3.PROPAGATION DELAY VS. SUPPLY VOLTAGEFIGURE 4.TRANSITION TIMES VS. AMBIENT TEMPERATURE9/91 Rev 1.1 2/94
Copyright © 1994
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11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
LINFINITY Microelectronics Inc.
元器件交易网www.cecb2b.com
SG1626/SG2626/SG3626
CHARACTERISTIC CURVES (continued)
FIGURE 5.
PROPAGATION DELAY VS. AMBIENT TEMPERATUREFIGURE 6.
TRANSITION TIMES VS. CAPACITIVE LOADFIGURE 7.
SUPPLY CURRENT VS. CAPACITANCE LOAD
FIGURE 8.
HIGH SIDE SATURATION VS. OUTPUT CURRENTFIGURE 9.
LOW SIDE SATURATION VS. OUTPUT CURRENTFIGURE 10.
SUPPLY CURRENT VS. FREQUENCY
FIGURE 11.
SUPPLY CURRENT VS. FREQUENCY
9/91 Rev 1.1 2/94
Copyright © 1994
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11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
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SG1626/SG2626/SG3626
APPLICATION INFORMATION
POWER DISSIPATION
The SG1626, while more energy-efficient than earlier gold-dopeddriver IC’s, can still dissipate considerable power because of itshigh peak current capability at high frequencies. Total powerdissipation in any specific application will be the sum of the DC orsteady-state power dissipation, and the AC dissipation caused bydriving capacitive loads.
The DC power dissipation is given by:PDC = +VCC · ICC [1]
where ICC is a function of the driver state, and hence is duty-cycledependent.
The AC power dissipation is proportional to the switching fre-quency, the load capacitance, and the square of the outputvoltage. In most applications, the driver is constantly changingstate, and the AC contribution becomes dominant when thefrequency exceeds 100-200KHz.
The SG1626 driver family is available in a variety of packages toaccommodate a wide range of operating temperatures andpower dissipation requirements. The Absolute Maximums sec-tion of the data sheet includes two graphs to aid the designer inchoosing an appropriate package for his design.
The designer should first determine the actual power dissipationof the driver by referring to the curves in the data sheet relatingoperating current to supply voltage, switching frequency, andcapacitive load. These curves were generated from data takenon actual devices. The designer can then refer to the AbsoluteMaximum Thermal Dissipation curves to choose a package type,and to determine if heat-sinking is required.DESIGN EXAMPLE
Given: Two 2500 pF loads must be driven push-pull from a +15volt supply at 100KHz. This is a commercial application wherethe maximum ambient temperature is +50°C, and cost is impor-tant.
1. From Figure 11, the average driver current consumptionunder these conditions will be 18mA, and the power dissipationwill be 15volts x 18mA, or 270mW.
2. From the Ambient Thermal Characteristic curve, it can beseen that the M package, which is an 8-pin plastic DIP with acopper lead frame, has more than enough thermal conductancefrom junction to ambient to support operation at an ambienttemperature of +50°C. The SG3626M driver would be specifiedfor this application.SUPPLY BYPASSING
Since the SG1626 can deliver peak currents above 3amps undersome load conditions, adequate supply bypassing is essential forproper operation. Two capacitors in parallel are recommendedto guarantee low supply impedance over a wide bandwidth: a0.1µF ceramic disk capacitor for high frequencies, and a 4.7µFsolid tantalum capacitor for energy storage. In military applica-9/91 Rev 1.1 2/94
Copyright © 1994
tions, a CK05 or CK06 ceramic operator with a CSR-13 tantalumcapacitor is an effective combination. For commercial applica-tions, any low-inductance ceramic disk capacitor teamed with aSprague 150D or equivalent low ESR capacitor will work well.The capacitors must be located as close as physically possible tothe VCC pin, with combined lead and pc board trace lengths heldto less than 0.5 inches.
GROUNDING CONSIDERATIONS
Since ground is both the reference potential for the driver logicand the return path for the high peak output currents of the driver,use of a low-inductance ground system is essential. A groundplane is highly recommended for best performance. In dense,high performance applications a 4-layer pc board works best; the2 inner planes are dedicated to power and ground distribution,and signal traces are carried by the outside layers. For cost-sensitive designs a 2-layer board can be made to work, with onelayer dedicated completely to ground, and the other to power andsignal distribution. A great deal of attention to component layoutand interconnect routing is required for this approach.LOGIC INTERFACE
The logic input of the 1626 is designed to accept standard DC-coupled 5 volt logic swings, with no speed-up capacitors re-quired. If the input signal voltage exceeds 6 volts, the input pinmust be protected against the excessive voltage in the HIGHstate. Either a high speed blocking diode must be used, or aresistive divider to attenuate the logic swing is necessary.LAYOUT FOR HIGH SPEED
The SG1626 can generate relatively large voltage excursionswith rise and fall times around 20-30 nanoseconds with lightcapacitive loads. A Fourier analysis of these time domain signalswill indicate strong energy components at frequencies muchhigher than the basic switching frequency. These high frequen-cies can induce ringing on an otherwise ideal pulse if sufficientinductance occurs in the signal path (either the positive signaltrace or the ground return). Overshoot on the rising edge isundesirable because the excess drive voltage could rupture thegate oxide of a power MOSFET. Trailing edge undershoot isdangerous because the negative voltage excursion can forward-bias the parasitic PN substrate diode of the driver, potentiallycausing erratic operation or outright failure.
Ringing can be reduced or eliminated by minimizing signal pathinductance, and by using a damping resistor between the driveoutput and the capacitive load. Inductance can be reduced bykeeping trace lengths short, trace widths wide, and by using 2oz.copper if possible. The resistor value for critical damping can becalculated from:RD = 2√L/CL [2]
where L is the total signal line inductance, and CL is the loadcapacitance. Values between 10 and 100ohms are usuallysufficient. Inexpensive carbon composition resistors are bestbecause they have excellent high frequency characteristics.They should be located as close as possible to the gate terminalof the power MOSFET.
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SG1626/SG2626/SG3626
TYPICAL APPLICATIONS
FIGURE 12.
When the SG3626 is driven from a totem-pole source with a peak output greater than 6 volts, a low-current, fast-switching blockingdiode is required at each logic input for protection. In this push-pull converter, the inverted logic outputs of the 3527A are idealcontrol sources for the power driver.
FIGURE 13.
In this forward converter circuit, the control capabilities of the SG3524B PWM are combined with the powerful totem-pole driversfound in the SG3626. This inexpensive configuration results in very fast charge and discharge of the power MOSFET gatecapacitance for efficient swithing.
9/91 Rev 1.1 2/94
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11861 Western Avenue ∞ Garden Grove, CA 92841
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SG1626/SG2626/SG3626
TYPICAL APPLICATIONS (continued)
FIGURE 14.
In half or full-bridge power supplies, driving the isolation transformers directly from the PWM can cause excessive IC temperatures,expecially above 100KHz. This circuit uses the high drive capacity of the SG3626 to solve the problem.
FIGURE 15.
A low-impedance resistive divider network can also be used as the interface between the PWM high-voltage logic output and theSG3626 power driver. In this 200KHz current mode converter, the SG3847 provides control, while the SG3626 provides highpower drive and minimizes ground spiking in the control IC.
9/91 Rev 1.1 2/94
Copyright © 1994
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11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
LINFINITY Microelectronics Inc.
元器件交易网www.cecb2b.com
SG1626/SG2626/SG3626
CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)
Package
14-PIN CERAMIC DIPJ - PACKAGE
Part No.SG1626J/883BSG1626J/DESCSG1626JSG2626JSG3626J
Ambient
Temperature Range-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
Connection Diagram
N.C.N.C.OUT AN.C.IN AN.C.GROUND
1234567
141312111098
VCCN.C.OUT BN.C.IN BN.C.N.C.
8-PIN CERAMIC DIPY - PACKAGE
SG1626Y/883BSG1626Y/DESCSG1626YSG2626YSG3626YSG2626MSG3626MSG2626DWSG3626DW
-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C-25°C to 85°C0°C to 70°C-25°C to 85°C0°C to 70°C
N.C.IN AGROUND
IN B
1234
8765
N.C.OUT AVCC
OUT B
8-PIN PLASTIC DIPM - PACKAGE16-PIN WIDE BODYPLASTIC S.O.I.C.DW - PACKAGE
N.C.IN AN.C.GROUNDGROUND
N.C.IN BN.C.
12345678
161514131211109
N.C.OUT AVCC
GROUNDGROUNDVCCOUT BN.C.
8-PIN TO-99 METAL CANT - PACKAGE
SG1626T/883BSG1626T/DESCSG1626TSG2626TSG3626T-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
VCC
OUT AN.C.2
IN A
3
4
5
81
7
OUT B
6
N.C.
IN B
GND
5-PIN TO-66 METAL CANR - PACKAGE
SG1626R/883BSG1626R/DESCSG1626RSG2626RSG3626R-55°C to 125°C-55°C to 125°C-55°C to 125°C-25°C to 85°C0°C to 70°C
VCC
OUT B
IN B
345
12
OUT AIN A
CASE IS GROUNDNote: Case and tab areinternally connected tosubstrate ground.
20-PIN CERAMIC (LCC)LEADLESS CHIP CARRIERL- PACKAGE
SG1626L/883B-55°C to 125°C
(Note 4)
1.2.3.4.5.6.7.8.9.10.N.C.
GROUNDN.C.IN AN.C.
GROUNDN.C.IN BN.C.
GROUND
3
45678
9
212019
1817161514
10111213
11.12.13.14.15.16.17.18.19.20.N.C.N.C.OUT BN.C.VccN.C.VccN.C.OUT AN.C.
Note1. Contact factory for JAN and DESC product availablity.
2. All packages are viewed from the top.9/91 Rev 1.1 2/94
Copyright © 1994
11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 ∞ FAX: (714) 893-2570
LINFINITY Microelectronics Inc.
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