专利名称：THERMAL MANAGEMENT IN ELECTRONIC
DEVICES WITH YIELDING SUBSTRATES
发明人：Michael A. Tischler申请号：US14211434申请日：20140314
公开号：US20140264427A1公开日：20140918
专利附图：
摘要：In accordance with certain embodiments, heat-dissipating elements areintegrated with semiconductor dies and substrates in order to facilitate heat dissipationtherefrom during operation.
申请人：Michael A. Tischler
地址：Vancouver CA
国籍：CA
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