专利名称：Chemical mechanical polishing aqueous
dispersion preparation set, method ofpreparing chemical mechanical polishingaqueous dispersion, chemical mechanicalpolishing aqueous dispersion, and chemicalmechanical polishing method
发明人：Kunitani, Eiichirou c/o JSR Corporation,,Shida,
Hirotaka c/o JSR Corporation,,Uchikura,Kazuhito c/o JSR Corporation
申请号：EP08157831.2申请日：20080609公开号：EP2017318B1公开日：20120530
摘要：A chemical mechanical polishing aqueous dispersion preparation set including: afirst composition which includes colloidal silica having an average primary particlediameter of 15 to 40 nm and a basic compound and has a pH of 8.0 to 11.0; and a secondcomposition which includes poly(meth)acrylic acid and an organic acid having two or morecarbonyl groups other than the poly(meth)acrylic acid and has a pH of 1.0 to 5.0.
申请人：JSR CORP
地址：JP
国籍：JP
代理机构：TBK
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