Substrate with preferably transferable layers and

专利名称：Substrate with preferably transferable

layers and/or surface structures, process forits preparation and the use thereof

发明人：HILBURGER, JAHANN,KASTNER, FRIEDRICH,

DR.,HUNDESHAGEN, KARL ARTHUR, DR.

申请号：EP03008151.7申请日：20030408公开号：EP1352732A2公开日：20031015

专利附图：

摘要：In substrates with preferably transferable structurized and/or unstructurized

layers (A) and/or surface structures (B), (A) are applied to or in a lacquer layer (C), which isthermoplastic at this stage, and/or (B) is produced by copying a matrix in (C) underpressure and temperature and/or by embossing, then (C) is stabilized. An Independentclaim is also included for production of these substrates by preparing a carrier substrate,coating this with lacquer layer (C), applying layers (A), optionally producing structures (B)and stabilizing (C).

申请人：HUECK FOLIEN GESELLSCHAFT M.B.H.

地址：Gewerbepark 30 4342 Baumgartenberg AT

国籍：AT

代理机构：Landgraf, Elvira, Dipl.-Ing.

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