专利名称:Coupling structure of optical fiber and
optical semiconductor element
发明人:Isao Yoneda,Junichi Sasaki,Masataka
Itoh,Hiroshi Honmou
申请号:US08/747817申请日:19961113公开号:US05717803A公开日:19980210
摘要:The optical fibers are arranged in a V groove formed at the surface of a siliconsubstrate and a cover is provided thereon. An electrode for solder bump is respectivelyformed at the position opposed with each other to the substrate and cover. Thesesubstrate and cover are deposited with solder in order to fix the optical fibers. Thesubstrate or cover is previously provided, at the end point part of the optical fibers, withthe mark for the positioning in the longitudinal direction of the optical fibers. The opticalfibers are positioned with this mark. Here, the side surface of the optical fibers isprovided with the metallized area at the position located in the predetermined distancefrom the end point thereof. Before fixing with the cover, the optical fibers can bedeposited automatically to the predetermined position without alignment due to theself-alignment effect between the mark and metallized area. Meanwhile, the opticalelement can be deposited with the solder bump without adjustment to the area near theend point of the optical fiber by utilizing the self-alignment. Here, it is also possible toform the mark to the substrate for measuring the mounting position of the opticalelement after deposition thereof.
申请人:NEC CORPORATION
代理机构:Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
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