专利名称：ENCAPSULATING DEVICE AND
ENCAPSULATING METHOD
发明人：WANG, Wei,SUN, Zhongyuan申请号：EP15832865申请日：20150810公开号：EP3255660A4公开日：20180808
摘要：The present disclosure relates to a packaging device and a packaging method.The packaging device includes a first platform and a second platform facing the firstplatform. The first platform moves back and forth towards or away from the secondplatform. The first platform is provided with a first electromagnetic device. The
packaging device further includes at least one patch which is capable of being adsorbedby the first electromagnetic device. One side of the patch is attached to the firstplatform, and the other side of the patch is configured to be attached to a substrate tobe packaged. The substrate is detachably fixed onto the first platform.
申请人：BOE Technology Group Co., Ltd.
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