IPC标准一览表

Updated May 24, 2000

IPC DOC #

TITLE

Page 1 of 18

PUBLICATION/ REVISION DATES

(IPC文件号) Roadmap (指南) SMC-TR-001

名称

National Technology Roadmap for Electronic Interconnections

(美国国家电子互联技术指南)

出版/修订日期

6/95 (orig. pub.)

SMT An Introduction to Tape Automated Bonding & Fine

1/89 (orig. pub.)

Pitch Technology(TAB和细间距SMT介绍)

4/92 (orig. pub.) Revision: A 1/95 Amendment 1: 3/96 Revision B: 10/96 Revision C: 3/00

J-STD-001 Requirements for Soldered Electrical and Electronic

Assemblies

代替 IPC-(电气、电子组件焊接技术要求) S-815

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement J-STD-001B

(J-STD-001B学习辅导书)

J-STD-002 Solderability Tests for Component Leads,Terminations,

Lugs, Terminals and Wires (元件引线,焊端,接线端和导线的可焊性

代替 IPC-S-805 测试) J-STD-003 Solderability Tests for Printed Boards(印制板可焊性测

试)

IPC-HDBK-001

3/98 (orig. pub.)

4/92 (orig. pub.) A 10/98

代替 IPC-S-804 J-STD-004 4/92 (orig. pub.)

Revision A: In process 1/95 (orig. pub.) Amendment 1 - 4/96 Revision A: In process

代替IPC-SF-818 J-STD-005 Requirements for Soldering Fluxes(助焊剂技术要求)

代替 IPC-SF-819

Requirements for Soldering Pastes(焊膏技术要求)

1/95 (orig. pub.) Amendment 1 - 1/95

J-STD-006 Requirements for Electronic Grade Solder Alloys and

Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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2011-3-4

IPC Document Revision Table

(电子级固态焊料技术要求)

Implementation of Flip Chip and Chip Scale Technology

J-STD-012

(FC和CSP器件的安装)

J-STD-013 IPC-DRM-18

Implementation of Ball Grid Array and Other High Density Technology(BGA和HDI器件的安装) Component Identification Desk Reference Manual (元器件封装辨认手册)

Page 2 of 18

1/96 (orig. pub.) 7/96 (orig. pub.) 9/95 (orig. pub.) Revision A: 4/96 Revision B: 2/97 Revision C: 7/98 October 1996 (orig. pub.)

Revision A: 3/99

Moisture/Reflow Sensitivity Classification of Plastic

J-STD-020 Surface Mount Devices(塑封表面器件对潮湿和再流焊

的敏感度要求) Through-Hole Solder Joint Evaluation Desk Reference

IPC-DRM-Manual

40

(通孔引线焊点评估参考手册) Surface Mount Solder Joint Evaluation Desk Reference

IPC-DRM-Manual SMT

(表面组装焊点评估参考手册)

8/98

8/75 (orig. pub.) A - 8/76 B - 6/80 C - 3/85 D - 11/88 E - 7/92 F - 6/96

4/87 (orig. pub.)

Revision A: In process 7/95 (orig. pub.)

IPC-T-50

Terms and Definitions Interconnecting and Packaging Electronic Circuits(电子电路互连及封装术语和定义)

IPC-SC-60 IPC-SA-61

Post Solder Solvent Cleaning Handbook (焊后溶剂清洗手册)

Post-Solder Semi-Aqueous Cleaning Handbook (焊后半水清洗手册)

IPC-AC-62 IPC-CH-65

Post Solder Aqueous Cleaning Handbook (焊后水清洗手册)

Guidelines for Cleaning of Printed Boards and Assemblies (印制板及其组件清洗导则)

12/86 (orig. pub.) 12/90 (orig. pub.)

Revision A: In process

IPC-CS-70 IPC-CM-78

Guidelines for Chemical Handling Safety in Printed Board

8/88 (orig. pub.)

Manufacturing(印制板制造化学处理安全准则)

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IPC Document Revision TablePage 3 of 18

被 IPC-SM-780替代 IPC-MP-83 IPC-PC-90

Guidelines for Surface Mounting and Interconnecting Chip Carriers

IPC Policy on Metrication(IPC公制化导则)

General Requirements for Implementation of Statistical Process Control(实施SPC的总技术规范)

11/83 (orig. pub.) C - 3/88 8/85 (orig. pub.) 10/90 (orig. pub.) 4/93 (orig. pub.) 3/76 (orig. pub.) A 10/80 B 6/90 3/76 (orig. pub.) A 10/80 B 7/92 A

1/94 (orig. pub.) Revision A: 12/97

General Requirements for Implementation of ISO 9000

IPC-QS-95 Quality Systems(实施 ISO 9000质量体系的总技术规

范) IPC-L-108 被 IPC-4101替代 IPC-L-109

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

被 IPC-4101 替代

Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards

IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for (已作废) Multilayer Printed Cicuit Boards

IPC-CC-110 Guidelines for Selecting Core Constructions for 被 IPC-Multilayer Printed Wiring Board Applications 4121替代 IPC-L-112

Specification for Composite Metal Clad Base materials for 7/81 (orig. pub.)

被 IPC-Printed Boards A 6/92

4101 替代

IPC-L-115

Specification for Rigid Metal Clad Base Materials for

被 IPC-Printed Boards

4101 替代

IPC-L-120 Inspection Procedure for Chemical Processing Suitability (己作废) of Copper-Clad Epoxy-Glass Laminates IPC-L-125 IPC-L-130 (已作废)

Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections (高速/高频塑性基板特性规范)

Specificaitons for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards

3/77 (orig. pub.)

A 10/80 B 4/90

8/83 (orig. pub.) A 7/92

1/77 (orig. pub.)

被 IPC-L-108 替代

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IPC Document Revision TableIPC-EG-140 IPC-SG-141 IPC-A-142 IPC-QF-143 IPC-CF-148

Specification for Finished Fabric Woven from \"E\" Glass for Printed Boards(\"E\"纤维织物印制板特性规范) Specification for Finished Fabric Woven from \"S\" Glass for Printed Boards (\"S\"纤维织物印制板特性规范)

Page 4 of 18

3/88 (orig. pub.) A 6/97* 2/92 (orig. pub.)

Specification for Finished Fabric Woven from Aramid for

6/90 (orig. pub.)

Printed Boards(Aramid纤维织物印制板特性规范) General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards (石英纤维织物印制板特性规范)

Resin Coated Metal for Printed Boards (印制板涂树脂金属箔)

6/90 (orig. pub.) A 9/98 8/66 (orig.pub.) A 9/67 B 2/71 C 8/74 D 3/76 E 5/81

F 10/91 , 8/92 G 5/99 6/90 (orig. pub.) A 1/94 B 3/98 7/85 (orig. pub.) 2/92 (orig. pub.)

IPC-MF-150

Metal Foil for Printed Wiring Applications (印制线路金属箔)

IPC-CF-152 IPC-FC-203 (已作废) IPC-FC-210 (已作废) IPC-FC-213 (已作废) IPC-FC-217 (已作废) IPC-FC-218B/ EIA-RS-429 (已作废) IPC-FC-219

Composite Metallic Material Specification for Printed Wiring Boards (印制板复合金属材料特性规范) Specification for Flat Cable, Round Conductor, Ground Plane

Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)

9/85 (orig. pub.)

Performance Specification for Flat Undercarpet Telephone

9/84 (orig. pub.)

Cable

General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable

General Specification for Connectors, Electrical Flat Cable Type

8/82 (orig. pub.) Reaffirmed 4/90 7/76 (orig. pub.) Reaffirmed 11/81 Reaffirmed 05/91

Environment Sealed Flat Cable Connectors for use in

2011-3-4

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Specification for Flat-Copper Conductors for Flat Cables Aerospace Applications

Page 5 of 18

5/84 (orig. pub.) orig. pub 5/70 A 1/74 B 8/75 C 7/85 8/75 (orig. pub.) A 5/84 6/80 (orig. pub.) 5/91 Reaffirmed 8/75 (orig. pub.) 10/85 Reaffirmed orig. pub. 7/74 A 5/83 B 2/86 C 4/92

Amendment 10/95

Specification for Flat Cable, Flat Conductor, Unshielded

Specification of Flat Cable Round Conductor, Unshielded

Flat Cable Design Guide

Flexible Base Dielectrics for Use in Flexible Printed Wiring

(柔性印制线路的绝缘基材)

代替IPC-FC-233A IPC-FC-233 (作废) IPC-FC-241 IPC-RF-245 被 IPC-6013 替代

Adhesive Coated Dielectric Films for Use as Cover Sheets 7/74 (orig. pub.)

A 5/83

for Flexible Printed Wiring and Flexible Bonding Films

B 2/86 C 4/92

(柔性电路绝缘涂覆胶粘剂) Amendment 10/95 -

Incorporated into IPC-FC-232B 7/74 (orig. pub.)

A 5/83 B 2/86 C 4/92

Amendment 10/95

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的绝缘基材)

Performance Specification for Rigid-Flex Printed Boards 4/87 (orig. pub.)

IPC-D-249 被 IPC-Design Standard for Flexible Single-and Double-Sided

2223

Printed Boards

1/87 (orig. pub.)

替代

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IPC Document Revision TableIPC-FC-250A 被 IPC-6013

Page 6 of 18

Specification for Single - and Double-Sided Flexible Printed Wiring 9/86 (orig. pub.) A 9/86

替代

Guidelines for Single and Double Sided Flex Circuits

2/92 (orig. pub.)

(单、双面柔性电路指南)

IPC-FA-251

IPC-D-275 被 IPC-2221 and Design Standard for Rigid Printed Boards and Rigid 2222 Printed Board Assemblies

9/91 (orig. pub.)

Amend.1 4/96

替代

IPC-RB-276

被 IPC-Qualification and Performance Specification for Rigid 6011 和 Printed Boards IPC-6012 替代

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies (可靠的印制板SMT设计指南)

8/60 (orig. pub.) A 7/61 B 1/64 C 10/65 D 1/70 E 10/70

F 11/74 Editorial revision G 1/84 9/69 (orig. pub.) A 12/77 B 12/85 C 06/91

3/92 (orig. pub.)

IPC-D-279 7/96 (orig. pub.)

Printed Board Dimensions and Tolerances

IPC-D-300

(印制板的尺寸和容差)

IPC-D-310

Guidelines for Phototool Generation and Measurement Techniques (照相底板生成和测量技术指南)

Process Control Guidelines for Phototool Generation and

IPC-A-311 Use

(照相底板生成和使用过程的控制指南)

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2011-3-4

IPC Document Revision Table

IPC-D-316

Page 7 of 18

Design Guide for Microwave Circuit Boards Utilizing Soft

5/95 (orig. pub.)

Substrates (软质基材的微波电路设计指南)

4/90 (orig. pub) A 1/95

Design Guidelines for Electronic Packaging Utilizing

IPC-D-317 High-Speed Techniques(电子封装用于高速技术的设计

指南) IPC-HF-318 被 IPC-6018

Microwave End Product Board Inspection and Test

6/85 (orig. pub.) A 12/91

替代

IPC-D-319 Design Standard for Rigid Single-and Double-Sided (作废) Printed Boards IPC-D-320A (作废)

(incorporates/supersedes IPC-TC-500

superseded by IPC-RB-276

1/77 (orig. pub.) A 3/81 B 11/86 8/84 orig. pub. Reaffirmed 9/91 10/88 (orig. pub.)

(金属芯电路板性能规范)

1/87 (orig. pub.) superseded by IPC-D-275

1/77 (orig. pub.) A 3/81

Printed Board, Rigid, Single- and Double-Side, End Product Standard

IPC-SD-320B (作废)

Performance Specification for Rigid Single- and Double-Sided Printed Boards

Guidelines for Selecting Printed Wiring Board Sizes

IPC-D-322 Using Standard Panel Sizes(拼板中印制板迭用尺寸指

南) IPC-MC-324

Performance Specifications for Metal Core Boards

Documentation Requirements for Printed Boards,

1/87 (orig. pub.)

IPC-D-325 Assemblies and Support Drawings (印制板、组件和支撑

A 5/95

件图纸文件要求) IPC-D-326

Information Requirements for Manufacturing Printed Board Assemblies(印制板组装制造的文件资料要求)

4/91 (orig. pub.)

12/89 (orig. pub.)

IPC-D-330 Design Guide Manual(设计指导手册) IPC-PD-335 (作废)

Electronic Packaging Handbook

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IPC Document Revision Table

Computer Numerical Control Formatting for Drillers and Routers

(钻孔和布线器的计算机控制数据格式)

Page 8 of 18

IPC-NC-349

8/85 (orig. pub.) 8/72 (orig. pub.) A 2/75 B 8/77

C 10/85 Reaffirmed D

7/92 Technical Content Identical to IEC-1182-1 8/85 (orig. pub.)

Printed Board Description in Digital Form

IPC-D-350

(印制板的数字化表述)

Printed Board Drawings in Digital Form

IPC-D-351

(印制板图形的数字化表述)

IPC-D-352

Electronic Design Data Description for Printed Boards in Digital Form (印制板电子设计数椐的数字化表述) Library Format Description for Printed Boards in Digital Form

(印制板文件格式的数字化表述)

Printed Board Assembly Description in Digital Form

IPC-D-355

(印制板组件的数字化表述)

Bare Board Electrical Test Information in Digital Form

IPC-D-356

(印制裸板电测信息的数字化表述)

IPC-AM-361 (作废) IPC-MB-380

Specification for Rigid Substrates for Additive Process Printed Boards

Guidelines for Molded Interconnection Devices

10/90 (orig. pub.)

(模制器件互连指南)

7/74 (orig. pub.) A 2/88 1/90 (orig. pub.) 3/92 (orig. pub.) A 1/98 1/82 (orig. pub.) 1/95 (orig. pub.) 8/85 (orig. pub.)

IPC-D-354 2/87 (orig. pub.)

IPC-D-390 Automated Design Guidelines(自动设计指南) IPC-C-406 IPC-CI-408

Design and Application Guidelines for Surface Mount Connectors (表面组装连接器设计和应用指南) Design and Application Guidelines for the Use of Solderless Surface Mount Connectors (非焊接表面组装连接器设计和应用指南)

1/94 orig. pub.

IPC-BP-

General Specification for Rigid Printed Board Backplanes

10/80 (orig. pub.) with Press-Fit Contacts

2011-3-4

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421 IPC-D-422

(带压接连接器的刚性印制背板通用技术规范) Design Guide for Press Fit Rigid Printed Board Backplanes

(刚性压接印制背板设计指南)

IPC-DW-424 IPC-DW-425 IPC-DW-426 IPC-TR-460 IPC-TR-461

General Specification for Encapsulated Discrete Wire Interconnection Boards

(印制板分立包皮导线互连通用技术规范) Design and End Product Requirements for Discrete Wiring Boards(分立线路板设计和成品技术规范) Specifications for Assembly of Discrete Wiring

Page 9 of 18

Reaffirmed 4/90 9/82 (orig. pub.)

1/95 (orig. pub.) 9/82 (orig. pub.) A 5/90

12/87 (orig. pub.)

(分立线路组装技术规范)

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards (印制板波峰焊故障检查表) Solderability Evaluation of Thick and Thin Fused Coatings

(厚、薄热涂层的可焊性评估)

1973 (orig. pub) A 2/84 3/79 (orig. pub.)

IPC-TR-462 IPC-TR-464 IPC-TR-465-1

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage (具有持效保护涂层的印制板可焊性评估) Accelerated Aging for Solderability Evaluations (可焊性的加速老化评估)

Round Robin Test on Steam Ager Temperature Control Stability

(恒温蒸汽老化的联合测试报告)

10/87 (orig. pub.)

orig. pub.4/84 A 12/87

1993

IPC-TR-465-2

The Effect of Steam Aging Time and Temperature on Solderability Test Results

(蒸汔老化时间和温度对可焊性测试结果的影响)

1993

IPC-TR-465-3 IPC-TR-466

Evaluation of Steam Aging on Alternative Finishes, Phase IIA

( 对不同处理剂的蒸汽老化评估,Phase IIA) Wetting Balance Standard Weight Comparison Test

7/96

4/95 (orig. pub.)

(润湿平衡标准称重比较测试)

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IPC Document Revision Table

Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D(ANSI/J-STD-001附件D的支持数据和数字举例)

Factors Affecting Insulation Resistance Performance of Printed Boards(印制板绝缘电阻的影响因素) Thermal Characteristics of Multilayer Interconnection Boards

(多层互连板的热特性)

IPC-TR-474 IPC-TR-476 IPC-TR-480 (作废) IPC-TR-481 IPC-TR-483 IPC-TR-484 IPC-TR-485 IPC-TR-549 IPC-TR-551 IPC-DR-570 IPC-DR-572 IPC-TR-file://E:\\RD\\ipc标准\\IPC标准（new）\\IPC标准一览表.htmlPDF 文件使用 \"pdfFactory Pro\" 试用版本创建 www.fineprint.cnPage 10 of 18

IPC-TR-467 IPC-TR-468 IPC-TR-470

10/96 (orig. pub.) 3/79 (orig. pub.)

1/74 (orig. pub.)

An Overview of Discrete Wiring Techniques(分立线路综3/79 (orig. pub.) 观) Reprint 1984 How to Avoid Metallic Growth Problems on Electronic Hardware(如何避免电子硬件的合金化生长) Results of Multilayer Test Program Round Robin IV Phase I

Results of Multilayer Test Program Round Robin V

4/81 (orig. pub.)

(多层V循环测试程序的结果)

Dimensional Stability Testing of Thin Laminates - Report

4/84 (orig. pub.)

on Phase I International Round Robin Test Program

10/87 Addendums Revised 3/91

(薄层压板尺寸稳定性测试---- )

Results of IPC Cooper Foil Ductility Round Robin Study

4/86 (orig. pub.)

(IPC Cooper 箔延展性研究联合报告)

Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔断裂强度研究联合报告) Measles in Printed Wiring Boards(印制板内的粉点) Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components (电子元件安装互连印制板的质量评定)

General Specification for 1/8 Inch Diameter Shank

Carbide Drills for Printed Boards(1/8英寸印制板硬质合金钻头总技术规范)

1/79 (orig. pub.) A 4/84 3/85 (orig. pub.) 11/73 (orig. pub.) 9/77 (orig. pub.) A 6/84 9/75 (orig. pub.)

7/93 (orig. pub.)

Drilling Guidelines for Printed Boards(印制板钻孔指南) 4/88 (orig. pub.)

2011-3-4

IPC Document Revision Table576 (已作废) IPC-TR-578

Page 11 of 18

Additive Process Evaluation

Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum

Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards(前沿制造技术报告---- )

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards (印制板小孔金属化可靠性评估联合报告)

9/77 (orig. pub.)

9/84 (orig. pub.)

IPC-TR-579

9/88 (orig. pub.)

IPC-TR-580 IPC-TR-581 IPC-TR-582

Cleaning and Cleanliness Test Program Phase 1 Test Results

(清洗和洁净度测试程序第1阶段测试结果) IPC Phase 3 Controlled Atmosphere Soldering Study

10/89 (orig. pub.)

8/94 (orig. pub.)

IPC Phase 3 可控气氛焊接研究)

IPC Phase 3 No-Clean Flux Study(IPC Phase 3免洗助焊剂研究)

11/94 (orig pub.) orig pub. '64 A '70 B '74 C '78 D '89 E 8/95 F 11/99 Revision A: 2/99

(印制板质量评定手册)

Printed Board Quality Evaluation Slide Set

(印制板质量评定,幻灯片)

8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88 A 3/90 B 12/94

Amendment 1/96 Revision C: 1/00

IPC-A-600 Acceptability of Printed Boards(印制板可接收条件)

IPC-QE-605A IPC-SS-605

Printed Board Quality Evaluation Handbook

Acceptability of Electronic Assemblies

IPC-A-610

(电子组装的可接收条件)

IPC-QE-615 IPC-SS-

Assembly Quality Evaluation Handbook(组装质量评定手

3/93 (orig. pub.)

册)

Assembly Quality Evaluation Slide Set(组装质量评定,幻

3/93 (orig. pub.)

2011-3-4

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615 IPC-AI-640 (已作废) IPC-AI-641 IPC-AI-642 IPC-OI-645 IPC-TM-650 IPC-ET-652

灯片)

User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates

User's Guidelines for Automated Solder Joint Inspection

Page 12 of 18

Revision A: 2/99 1/87 (orig. pub.)

1/87 (orig. pub.)

(自动焊点检查用户指南)

User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's

(照相底图,内层和PCB裸板自动检查用户指南) Standard for Visual Optical Inspection Aids

10/93 (orig. pub.)

(光学检查目测标准)

Test Methods Manual(测试方法手册)

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (PCB裸板电气测试要求和导则)

Updated per test method 10/88 (orig. pub.)

10/90 (orig. pub.)

IPC-QL-653 IPC-MI-660 IPC-R-700C 被 IPC-7711 and 7721

Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material

(检查/测试印制板,元件和材料的设备鉴定) Incoming Inspection of Raw Materials Manual

8/88 (orig. pub.) A 11/97

2/84 (orig. pub.)

(原材料来料检查手册)

9/67 (orig. pub.) A 12/71 B 9/77 C 1/88

Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies

替代 IPC-TA-720 IPC-TA-721 IPC-TA-722

Technology Assessment Handbook on Laminates

(层压板技术评估手册)

Technology Assessment Handbook on Multilayer Boards

(多层板技术评估手册)

Technology Assessment of Soldering(焊接技术评估)

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IPC Document Revision Table

Technology Assessment Handbook on Surface Mounting

(表面组装技术评估手册)

Technology Assessment Series on Cleanrooms (净化间技术评估)

Troubleshooting Guide for Printed Board Manufacture and Assembly(印制板制造及组装故障修理指南)

4/98

Page 13 of 18

IPC-TA-723 IPC-TA-724 IPC-PE-740

1/85 (orig pub.) A 12/97 9/68 (orig. pub.) A 3/76 B 10/80 C 1/87 D 1/96

IPC-CM-770 IPC-SM-780 IPC-SM-782 IPC-EM-782 IPC-SM-784 IPC-SM-785

Printed Board Component Mounting(印制板元件安装)

Component Packaging and Interconnecting with Emphasis

3/88 (orig. pub.)

on Surface Mounting(片式元件SMC的封装和互连) Surface Mount Design and Land Pattern Standard (表面组装设计和焊盘图形标准)

Surface Mount Design and Land Pattern Spreadsheet (表面组装设计和焊盘图形电子表格) Guidelines for Chip-on-Board Technology Implementation (COB技术应用指南)

Guidelines for Accelerated Reliability Test of Surface

Mount Solder Attachments (表面组装焊接可靠性加速试11/92 (orig. pub.) 验指南)

12/90 (orig. pub.) A 1/95

3/87 (orig. pub.) 9/89 A 8/93

Amendment 1 10/96 9/94 (orig. pub.) Addendum 12/95

11/90 (orig. pub.)

IPC-SM-786

Procedures for Characterizing and Handling of Moisture/

已被 J-Reflow Sensitive ICs

STD-020替代 IPC-MC-790

Guidelines for Multichip Module Technology Utilization

8/92 (orig. pub.)

(多芯片模块技术应用指南)

IPC-S-804

(已作废) Solderability Test Methods for Printed Wiring Boards 被 J-STD-003

1/82 (orig. pub.)

A 1/87

替代

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IPC-S-805

(已作废) Solderability Tests for Component Leads and 被 J-STD-Terminations

002

替代 IPC-MS-810

Guidelines for High Volume Microsection( 显微切面指南)

Page 14 of 18

1/85 (orig. pub.)

10/93 (orig. pub.)

IPC-S-815

(已作废) General Requirements for Soldering Electronic 被 J-STD-Interconnections

001

(已废除,由J-STD-001替代)

替代 IPC-S-816 SMT Process Guideline and Checklist( SMT工艺指南和

检查表) IPC-SM-817

General Requirements for Dielectric Surface Mounting Adhesives (绝缘性表面组装胶粘剂通用规范)

11/77 (orig. pub.) A 6/81 B 12/87

7/93 (orig. pub.) 11/89 (orig. pub.)

IPC-SF-818

(作废) General Requirement for Electronic Soldering Fluxes 被 J-STD-004 (用于电子组件焊接的助焊剂通用技术要求)

2/88 (orig. pub.)

12/91

替代

IPC-SP-819

(作废) 被General Requirements and Test Methods for Electronic J-STD-005 Grade Solder Paste

10/88 (orig. pub.)

替代 IPC-AJ-820 IPC-CA-821

Assembly and Joining Manual(组装和连接手册) General Requirements for Thermally Conductive Adhesives

(热导胶粘剂通用技术要求)

IPC-CC-830

Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies (印制板组装电绝缘材料的鉴定和性能) Pre and Post Solder Mask Application Cleaning

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1/84 (orig. pub.) 4/90 Reaffirmed A 10/98 8/96 (orig. pub.)

1/95 (orig. pub.)

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Guidelines

Page 15 of 18

IPC-SM-839 IPC-SM-840

4/90 (orig. pub.)

(焊接前,后阻焊膜的清洗指南)

Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards (印制板阻焊膜的鉴定和性能)

11/77 (orig. pub.) A 7/83 B 5/88 C 1/96

10/82 (orig. pub.)

IPC-H-855

Hybrid Microcircuit Design Guide

(己作废) IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits

(厚膜多层混合电路设计标准)

IPC-HM-860 IPC-TF-870

Specification for Multilayer Hybrid Circuits

12/89 (orig. pub.)

1/87 (orig. pub.)

(多层厚膜电路技术规范)

Qualification and Performance of Polymer Thick Film Printed Boards(聚合物厚膜印制板的鉴定和性能)

11/89 (orig. pub.)

IPC-D-949 (作废) Design Standard for Rigid Multilayer Printed Boards

被IPC-D-275 替代 IPC-ML-950 (已作废) 被 IPC-RB-276替代 IPC-ML-960 IPC-ML-975

1/87 (orig. pub.)

1/66 (orig. pub.) A 9/70 B 12/77 C 11/86

Performance Specification for Rigid Multilayer Printed Boards

Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards (多层印制板预制内层敷箔板的鉴定和性能规范)

7/94 (orig. pub.)

被IPC-D-325 替代 IPC-ML-990

End Product Documentation Specification for Multilayer Printed Wiring Boards

9/69 (orig. pub.)

Performance Specification for Flexible Multilayer Wiring 9/72 (orig. pub.)

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IPC Document Revision Table

(作废)

IPC-Hybrid Microcircuit Design Guide(混合微波电路设计指

1402/IPC-南)

H-855 IPC-1710

OEM Standard for Printed Board Manufacturers' Qualification

Profile (MQP) (印制板OEM制造商资格鉴定一览表) Assembly Qualification Profile (AQP)

IPC-1720 (印制板组装制造商资格鉴定一览表)

Laminator Qualification Profile (LQP)

IPC-1730

(层压板制造商资格鉴定一览表)

IPC-2141

Controlled Impedance Circuit Boards and High Speed Logic Design(阻抗调制电路板和高速逻辑电路设计)

1/98

Page 16 of 18

10/82 (orig. pub.) 2/94 (orig. pub.) 12/97 updated

7/96 (orig. pub.)

4/96 (orig. pub.) 2/98(orig. pub.)

IPC-2221 Generic Standard on Printed Board Design 代替 IPC-D-275 (印制板设计通用标准) Sectional Design Standard for Rigid Organic Printed IPC-2222

Boards

代替 IPC-D-275

(刚性有机印制板设计标准)

Sectional Design Standard for Flexible Printed Boards

IPC-2223

(柔性印制板设计标准)

IPC-3406

Guidelines for Electrically Conductive Surface Mount Adhesives

(表面组装导电胶导则)

IPC-3408 IPC-4101

Specification for Base Materials for Rigid and Multilayer

代替 IPC-Boards L-108 IPC-L-109

(刚性及多层印制板基材特性规范)

IPC-L-112 IPC-L-115

Specification and Characterization Methods for

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2/98(orig. pub.)

11/98

7/96 (orig. pub.)

11/96 (orig.pub.)

12/97 (orig. pub.)*

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IPC Document Revision Table

Nonwoven Cellulose Based Paper for Printed Boards

IPC-4110

(非织物纤维纸印制板的特性和规格)

IPC-4130 IPC-6011

(印制板通用性能规范)

IPC-6012 IPC-6013

Qualification and Performance Specification for Rigid Printed Boards(刚性印制板的鉴定与性能规范) Qualification and Performance Specification for Flexible Printed Boards (柔性印制板的鉴定与性能规范) Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

(有机多芯片模块(MCM-L)组装及互连结构的鉴定和性能规范)

Microwave End Product Board Inspection and Test

IPC-6018

(微波产品电路板的检查和测试)

Performace Guide Manual for Single- and Double-Sided

IPC/JPCA-Flexible Printed Wiring Boards 6202

(单、双面柔性印制电路板性能指导手册) IPC-7711

Rework of Electronic Assemblies (电子组件的返修)

2/99

Specification and Characterization Methods for

Nonwoven \"E\" Glass Mat(非织物‘E’玻璃垫规范) Generic Performance Specification for Printed Boards

9/98* 8/98*

Page 17 of 18

7/96 (orig. pub.)* 7/96 (orig. pub.) A 10/99 11/98

IPC-6015 2/98 (orig. pub.)

1/98(orig. pub.)

代替 IPC-R-700C IPC-7721

4/98 (orig. pub.)

代替 IPC-R-700C IPC-9191

Repair and Modification of Printed Boards and Electronic

4/98 (orig. pub.)

Assemblies(印制板和电子组件的修理和调整)

代替

IPC-PC-90 IPC-9201

General Guideline for implementation of Statistical Process Control (SPC) (SPC实施通则) Surface Insulation Resistance Handbook

11/99 (orig.pub)

7/96 (orig. pub.)

(表面绝缘电阻手册)

PWB Assembly Process Simulation for Evaluation of 7/95 (orig. pub.)

Electronic Components(电子元件组装工艺仿真的评价) Revision A: In process

IPC-9501

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IPC Document Revision Table

Assembly Process Simulation for Evaluation of Non-IC IPC-9504 6/98 Components(非IC器件组装工艺仿真的评价)

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