专利名称：Method of fabricating an electronic device发明人：Tarng-Shiang Hu,Jia-Chong Ho,Liang-Ying
Huang,Cheng-Chung Lee
申请号：US11131387申请日：20050518公开号：US07179697B2公开日：20070220
专利附图：
摘要：A method of fabricating an electronic device includes the following steps: a)providing a substrate; b) forming a first strip on the substrate; c) coating an insulationlayer on the first strip and the substrate while completely overlaying the first strip and
the substrate with the same; d) forming a second strip on the insulation layer; e) formingconductive polymer on the insulation layer while completely overlaying the second stripwith the same; f) etching the conductive polymer via plasma etching for completelyremoving the conductive polymer on the second strip; and g) forming a semiconductorlayer on the second strip and the conductive polymer.
申请人：Tarng-Shiang Hu,Jia-Chong Ho,Liang-Ying Huang,Cheng-Chung Lee
地址：Hsinchu TW,Taipei TW,Hsinchu TW,TaiChung TW
国籍：TW,TW,TW,TW
代理机构：Troxell Law Office, PLLC
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