LIGHT EMITTING DIODE ASSEMBLY STRUCTURE

专利名称：LIGHT EMITTING DIODE ASSEMBLY

STRUCTURE

发明人：CHIH-WEI CHANG,ZHI-TING YE,SHYI-MING

PAN

申请号：US15472203申请日：20170328

公开号：US20180033928A1公开日：20180201

专利附图：

摘要：A light emitting diode assembly structure includes a light emitting chip, a colorconverting layer, a light guiding member, and a reflecting member. The color converting

layer coats the light emitting chip and the light guiding member coats the colorconverting layer. The planar or non-planar reflecting member is arranged over the lightguiding member. The reflecting member is faced towards the light emitting chip andchanges the range of illumination of the light emitted by the light emitting chip. Thereflecting member can be arranged on a side of the color converting layer and light canbe irradiated towards the exterior of the light emitting diode assembly structure.

申请人：HARVATEK CORPORATION

地址：Hsinchu TW

国籍：TW

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