专利名称：Lead frame for semiconductor device发明人：Takahashi, Kenji,Asada, Junichi,Hayashi,
Kazunori
申请号：EP91106136.4申请日：19910417公开号：EP0452903A2公开日：19911023
专利附图：
摘要：A lead frame for a semiconductor device having: first and second frame portions(1, 1) facing each other and spaced apart by a predetermined distance; an island (4)formed at a position sandwiched between the first and second frame portions (1, 1) for
mounting a semiconductor chip; a pair of tie bars (22, 22) for integrally coupling the firstframe portion (1) and a side of the island (4) facing the first frame portion, the pair of tiebars (22, 22) being formed with a predetermined space in the widthwise direction; and apair of tie bars (22, 22) for integrally coupling the second frame portion (1) and a side ofthe island (4) facing the first frame portion, the pair of tie bars (22, 22) being formed witha predetermined space in the widthwise direction.
申请人：KABUSHIKI KAISHA TOSHIBA
地址：72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 JP
国籍：JP
代理机构：Lehn, Werner, Dipl.-Ing.
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