专利名称：Method for coating a substrate发明人：Katrin Fischer,Florian Palitschka,Darren
Robert Southworth,William Whitney
申请号：US15093834申请日：20160408公开号：US09799554B2公开日：20171024
专利附图：
摘要：A method for coating substrates provided with vias uses a first step in which thesubstrate is conditioned and a second step in which the substrate is coated with anelectrically insulating material such that the vias are filled up completely.
申请人：SUSS MicroTec Lithography GmbH
地址：Garching DE
国籍：DE
代理机构：Hayes Soloway PC
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