专利名称：INTEGRATED CIRCUIT PACKAGES WITH
PLATES
发明人：Omkar G. Karhade,Edvin Cetegen,Sandeep B.
Sane
申请号：US16349959申请日：20161214
公开号：US20190279960A1公开日：20190912
专利附图：
摘要：Disclosed herein are integrated circuit (IC) packages with plates, as well asrelated devices and methods. For example, in some embodiments, an IC package may
include: a package substrate; a plurality of electrical components secured to a face of thepackage substrate; and a plate secured to the plurality of electrical components with anadhesive such that the plurality of electrical components are between the plate and thepackage substrate.
申请人：Intel Corporation
地址：Santa Clara CA US
国籍：US
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