专利名称：INTEGRATED CIRCUIT PACKAGE HAVING A
THERMOELECTRIC COOLING ELEMENTTHEREIN
发明人：MEISSNER, Edward, G.申请号：EP99914320.9申请日：19990331公开号：EP1070350B1公开日：20030917
摘要：A package (10, 60, 80) has a chamber (24) containing an integrated circuit (13)which detects infrared radiation. The package has on one side of the integrated circuit aportion (23) transparent to infrared radiation, and has on the opposite side of theintegrated circuit a first part (12) which supports the integrated circuit. A second part (36)of the package is spaced from the first part (12) on the side thereof opposite from theintegrated circuit. Thermoelectric cooling elements (51) are provided between and arethermally coupled to the first and second parts. Electrically conductive further elements(44) are also disposed between the first and second parts. A first arrangement (32, 29, 17,18) electrically couples a terminal on the integrated circuit to a first end of the furtherelement. A second arrangement (41, 38) electrically couples each further element to arespective pad (42) disposed on the side of the second part opposite from the first part.Some of the thermoelectric cooling elements may have one cross-sectional shape, othersmay have a different cross-sectional shape, and the further elements may have stillanother cross-sectional shape.
申请人：RAYTHEON CO
地址：US
国籍：US
代理机构：Legg, Cyrus James Grahame
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