专利名称：Radiating plate structure and method for
manufacturing semiconductor devices usingthe same structure
发明人：Yoshihiro Tomita,Hironori
Matsushima,Hirofumi Makimoto
申请号：US09658040申请日：20000908公开号：US06399422B1公开日：20020604
专利附图：
摘要：A thermosetting epoxy adhesive is applied at the end portion of one surface ofthe radiating plate onto which a protection ring is bonded, and a protection tapeprovided with projections is pasted with the thermosetting epoxy adhesive so thatprojections may project to the opposite side of the radiating plate , to constitute theradiating plate structure as one piece. And the radiating plate structures are stackedwithin the magazine of the radiating plate mounting machine, each radiating platestructure being picked up by the radiating plate mounting machine, its protection tapebeing peeled, the radiating plate being mounted at a predetermined position.
申请人：MITSUBISHI DENKI KABUSHIKI KAISHA,MITSUBISHI ELECTRIC KUMAMOTO
SEMICONDUCTOR CORPORATION
代理机构：McDermott, Will & Emery
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容