Package For Semiconductor Device Including Guide R

专利名称：Package For Semiconductor Device Including

Guide Rings And Manufacturing Method OfThe Same

发明人：HanShin Youn,Yonghwan Kwon,YoungHoon

Ro,Woojae Kim,Sungwoo Park

申请号：US13188069申请日：20110721

公开号：US20120074566A1公开日：20120329

专利附图：

摘要：An example embodiment relates to a semiconductor package. The

semiconductor package includes a first substrate including a first pad, a second substrateupwardly spaced apart from the first substrate and including a second pad opposite tothe first pad. At least one electrode is coupled between the first pad and the second pad.The semiconductor package includes a guide ring formed at a periphery of the electrodebetween the first substrate and the second substrate.

申请人：HanShin Youn,Yonghwan Kwon,YoungHoon Ro,Woojae Kim,Sungwoo Park

地址：Hwaseong-si KR,Suwon-si KR,Hwaseong-si KR,Hwaseong-si KR,Anyang-si KR

国籍：KR,KR,KR,KR,KR

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