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Microstructure, process for manufacturing thereof

2021-03-05 来源:步旅网
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专利名称:Microstructure, process for manufacturing

thereof and devices incorporating the same

发明人:Takayuki Yagi,Masatake Akaike申请号:US08/378610申请日:19950126公开号:US05658698A公开日:19970819

摘要:A microstructure comprising a substrate (1), a patterned structure (beammember) (2) suspended over the substrate (1) with an air- space (4) therebetween andsupporting structure (3) for suspending the patterned structure (2) over the substrate(1).

The microstructure is prepared by using a sacrificial layer (7) which is removed to formthe space between the substrate (1) and the patterned structure (2) adhered to thesacrificial layer. In the case of using resin as the material of the sacrificial layer, thesacrificial layer can be removed without causing sticking, and an electrode can beprovided on the patterned structure.

The microstructure can have application as electrostatic actuator etc., depending onchoice of shape and composition.

申请人:CANON KABUSHIKI KAISHA

代理机构:Fitzpatrick, Cella, Harper & Scinto

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