Packaging Information / 参考パターン寸法 Reference Pattern Layout Dimensions ●外形寸法図 / Packaging Information
1PIN INDENT
4.0±0.10Unit: (mm)
4.0±0.100.75±0.050.40±0.1789101112(0.50)+0.080.22-0.0765(2.5)4321131415161718242322212019
● 参考パターンレイアウト/
Reference Pattern Layout
(2.5)
テーピング仕様 / Taping Specifications
QFN0404-24C
●リール/Reel
●テーピング仕様/Taping Specifications
13.0-0
(1.5)
+0.1
(リール巻芯部寸法)2.1±0.6
Φ13.4±0.6
1,000pcs/Reel
direction of feed 5.5±0.0512.0±0.3(1.75)R Type :[Device orientation : Right]
Standard feed
(4.45)QFN0404-24C Power DissipationPower dissipation data for the QFN0404-24C is shown in this page.The value of power dissipation varies with the mount board conditions.Please use this data as the reference data taken in the following condition.
1. Measurement ConditionCondition:Mount on a boardAmbient:Natural convectionSoldering:Lead (Pb) free
2
Board Dimensions:40 x 40 mm (1600mm)Board Structure:4 Copper Layers
Each layer is 50% connected to the package heat-sink.
Material:Glass Epoxy (FR-4)Thickness:1.0 mmThrough-hole:4 x 0.4 Diameter
40.0
2.5
2.541.4Thermal Resistance(℃/W)
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Ambient Temperature（℃）Power Dissipation Pd（mW）
25
851500600Pd vs Ta
28.928.9
66.67
Power Dissipation Pd（mW）16001400120010008006004002000
25
45
65
85
105
125
Ambient Temperature Ta（℃）
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40.0
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