专利名称：Thermally conductive adhesive发明人：Jerome T. Adams,Bruce A. Yost申请号：US07/520286申请日：19900507公开号：US05026748A公开日：19910625
摘要：Adhesive resins are filled with carbon fibers that have a three- dimensionalstructure. The fibers have variable lengths and widths. The fiber filled adhesive exhibitshigh thermal conductivity values. Electronic systems having components bonded by alayer of these adhesives resins have high through-the-thickness thermal conductivity.
申请人：E. I. DU PONT DE NEMOURS AND COMPANY
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